Abstract:This proposal addresses the immediate need for models for accurate description of metal matrix composite (MMC) response to multiaxial loadings such as those existing in most turbine engine components. The model is needed for both design and life prediction of engine components. The proposed effort… more
Abstract:THE HIGH TEMPERATURE STRENGTH OF CERAMIC MATERIALS MAKE THEM ATTRACTIVE FOR USE IN HIGH EFFICIENCY COMBUSTION ENGINES. UNFORTUNATELY, THE POOR FRICTION AND WEAR PROPERTIES OF COMMON CERAMICS OFTEN PRECLUDE THEIR USE IN ROTATING AND SLIDING COMPONENTS. SOLID STATE LUBRICANTS ARE A POTENTIAL SOLUTION… more
Abstract:IN ORDER FOR ROBOTIC TECHNOLOGY TO MOVE INTO THE NEXT GENERATION, IT MUST EVOLVE FROM STANDALONE COMPONENT OPERATION TO THE CONCEPT OF TOTALLY INTEGRATED SYSTEMS OF MANY CONCURRENTLY EXECUTING SUBSYSTEMS THAT ARE CONSTANTLY EVOLVING. FURTHER, THIS TECHNOLOGY MUST SUPPORT ADDITIONAL SYSTEM ACTIVITIES… more
Abstract:Silicon carbide promises near-term insertion in high power, high temperature, applications. The wide band-gap and consequent high breakdown field of silicon carbide theoretically allows efficient high power solid state power amplifiers. Its high thermal conductivity will permit compact devices and… more
Abstract:Efficient blue and UV lasers are key to high density optical storage, novel communication systems, industrial and medical lasers, and specialized spectroscopic tools. By virtue of their direct bandgap (ranging from 2.09eV-InN to 3.44eV-GaN to 6.2eV-AlN) and lattice-matched heterostructure system,… more
Abstract:We propose a novel growth technique to produce low defect density GaN substrates - misfit dislocations will be greatly reduced and the defects due to thermal expansion mismatches will be eliminated. In Phase I the feasibility of the technology will be demonstrated. In Phase II, the process will be… more
Abstract:The ability to control large amounts of power (1-150kW) is necessary in applications ranging from aerospace to consumer electronics to industrial power systems and transportation. In order for silicon and gallium arsenide devices to meets such high power densities, tens of devices must be combined… more
Abstract:Future aeropropulsion systems require high temperature electronics and integrated sensors to meet desired performance levels. The wide bandgap of silicon carbide (SiC) makes it ideally suited for high temperature operation. To date, virtually all SiC-based devices have been fabricated using 6H-SiC.… more
Abstract:The demand for higher performance semiconductor devices is pushing the limits of current materials technology. The development of a high dieletric constant capacitor material with 10 - 100 times the charge storage of SiO2 would allow a flat capacitor cell to be used in 256 Mb DRAMs, and simple… more
Abstract:THE DEVELOPMENT OF A DENSE, FAST SUPERCONDUCTING MEMORY TECHNOLOGY WILL FACILITATE THE INTEGRATION OF SUPERCONDUCTING ELECTRONICS INTO SPACE AND ELECTONIC WARFARE SYSTEMS. A SUPERCONDUCTOR BASED MAGNETIC MEMORY TECHNOLOGY IS PROPOSED WHICH CAN BE USED TO FABRICATE MULTIMEGABIT SUPERCONDUCTOR… more
Abstract:THE AVAILABILITY OF EFFICIENT BLUE LIGHT EMITTERS WOULD BREAK OPEN COMMERCIAL AND DEFENSE MARKETS IN FULL COLOR DISPLAYS AND HIGH DENSITY OPTICAL STORAGE SYSTEMS. NITRIDE-BASED DEVICES HAVE THE GREATEST POTENTIAL AS HIGH EFFICIENCY EMITTERS BECAUSE OF THEIR DIRECT BANDGAP AND CONVENIENT… more
Abstract:The primary objective of this proposed work is to develop a method of producing integrally stiffened, complex shaped monolithic structural components in high strength aluminum alloys at a lower cost and lighter weight than equivalent conventional built-up assemblies. In Phase I the feasibility of… more
Abstract:THE DEVELOPMENT OF COLD ELECTRON EMITTER TECHNOLOGY HAS THE POTENTIAL FOR BROADLY IMPACTING THE RAPIDLY GROWING AREA OF ELECTRON SPECTROSCOPY. COMMERCIALLY AVAILABLE INSTRUMENTATION SUCH AS AUGER SPECTROMETERS TYPICALLY EMPLOY THERMIONIC ELECTRON SOURCES WHICH RESTRICT THEIR SCOPE OF USE THROUGH… more
Abstract:Chemical vapor deposition (CVD) of copper for vias and interconnects is critical to manufacture of next generation high speed ULSI devices and has been extensively investigated over the last few years. Although considerable progress has been made commercialization of this technology is currently… more
Abstract:Sensors and electronics will become increasingly pervassive as weight, fuel efficiency, cost and emissions requirements put increasing demands on vehicle technology. The development of high temperture, integrated sensors and electronics is necessary to cost-effectively address both civilian and… more
Abstract:As we approach the 21st century, increases in traffic accidents, the creeping paralysis of traffic congestion, and global environmental pollution have focused attention on reconciling the internal combustion engine (ICE) powered vehicle with the needs of the greater society. The solutions to these… more
Abstract:All future combustion and electric powered automobiles will be equipped with sensors directly interfaced with control electronics. The control and power electronics for combustion engines will have to cope with high temperatures and adverse environments. Hybrid and electric vehicles require new… more
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