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High-Power, High-Voltage, Bidirectional DC-DC Converter

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-05-C-0118
Agency Tracking Number: A043-240-1850
Amount: $119,949.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A04-240
Solicitation Number: 2004.3
Timeline
Solicitation Year: 2004
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-01-31
Award End Date (Contract End Date): 2005-07-31
Small Business Information
3259 Progress Drive, Ste. A
Orlando, FL 32826
United States
DUNS: 098250561
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Rod Muhaisen
 Principle Engineer
 (407) 275-1174
 rod@apecor.com
Business Contact
 Antoine Khoury
Title: President/ Contract Administrator
Phone: (407) 275-1174
Email: akhoury@apecor.com
Research Institution
N/A
Abstract

The objective of this research is to investigate the technical feasibility of building a bidirectional converter to achieve the power density, efficiency, and coolant temperature objectives using an innovative marriage of state-of-the-art technologies. These technologies each represent innovations in their respective fields. The power electronics team at Advanced Power Electronics Corp. is proposing to investigate and design a modular converter with multiple, smaller capacity units operating in a parallel, interleaved fashion each employing soft-switching techniques. The modularity of the system will distribute heat load between the semiconductor devices which will promote a lower junction temperature while interleaving will allow for smaller system magnetics. The effective use of soft-switching techniques will reduce losses thus improving efficiency and power dissipation in the devices. The design will focus on compatibility with advanced cooling techniques. The thermal management/packaging team at Rini Technologies Inc. will incorporate the emerging evaporative spray cooling (ESC) technology. The proposed cooling system will be enclosed with the converter and reject heat to an external coolant loop at 100?C. Further, the team will coordinate with semiconductor device manufacturers to repackage selected devices to make them more compatible with ESC. In the Phase I option, the team will build a small-scale prototype in order to prove the proposed design concepts.

* Information listed above is at the time of submission. *

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