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INTEGRATED OPTICS SCANNER FOR WAFER INTERCONNECT

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 5509
Amount: $229,500.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1989
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2950 Ne - 84th Ln
Blaine, MN 55432
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Anil K Jain
 (612) 784-4995
Business Contact
Phone: () -
Research Institution
N/A
Abstract

CONVENTIONAL INTERCONNECT AND SWITCHING TECHNOLOGY HAS BEEN IDENTIFIED AS A LIMITATION IN HIGH THRUPUT PROCESSORS AND COMPUTERS. WAFER SCALE INTEGRATION IS ONE TECHNIQUE TO RESOLVE INTERCONNECT PROBLEMS. METHODS OF INTERFACING TO WAFER SCALE DEVICES WILL RESOLVE INTERCONNECT PROBLEMS. METHODS OF INTERFACING TO WAFER SCALE DEVICES WILL REQUIRE OPTICAL INTERCONNECT TECHNIQUES. IMPLEMENTING COMMUNICATION IN AVIONICS SYSTEMS EMPLOYING FULL WAFER UNION BY MENAS OF A FREE SPACE OPTICAL LASER BEAM COMMUNICATION LINK IS PROPOSED. THE IMPLEMENTATION IS BASED UPON A LASER SCANNING CONCEPT DEVELOPED BY APA OPTICS. THE LASER SCANNING CONCEPT WAS SHOWN FEASIBLE IN A NASA PHASE I SBIR PROGRAM. THE CONCEPT IS UNIQUE IN PERMITTING LASER SCANS OF LARGE ANGULAR DEFLECTION WITHOUT THE USE OF MOVING PARTS. WHEN INTEGRATED INTO FULL WAFER SCALE PACKAGING OF AVIONICS IT CAN PROVIDE THE COMMUNICATION CAPABILITY NEEDED IN HIGH THROUGHOUT SYSTEMS. THE KEY ELEMENT IN THE PROPOSED WORK IS THE DEVELOPMENT AND DEMONSTRATION OF A MEANS OF EFFICIENCY CONTROLLING A TWO-DIMENSIONAL LASER COMMUNICATION BEAM SCAN.

* Information listed above is at the time of submission. *

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