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American Semiconductor, Inc.

Company Information
Address
6987 W Targee St
Boise, ID 83709-3209
United States


https://www.americansemi.com

Information

UEI: C1BNR9HJBQK8

# of Employees: 13


Ownership Information

HUBZone Owned: No

Socially and Economically Disadvantaged: No

Woman Owned: No



Award Charts




Award Listing

  1. ForeWarm: FHE Microclimate Heating System for Strength and Dexterity

    Amount: $572,561.80

    American Semiconductor’s programmable forearm worn hand and finger heating system (ForeWarm™) implements advanced flexible electronic and printed heater materials in an innovative stretchable wear ...

    SBIRPhase II2020Department of Defense Army
  2. ForeWarm: FHE Microclimate Heating System for Strength and Dexterity

    Amount: $107,910.65

    American Semiconductor’s programmable forearm worn hand and finger heating system (ForeWarm™) implements advanced flexible electronic and printed heater materials in an innovative stretchable wear ...

    SBIRPhase I2019Department of Defense Army
  3. Enabling Flexible Materials, Devices and Processes for Defense

    Amount: $1,349,974.00

    ABSTRACT:Emergence and feasibility for flexible body-worn electronics and particularly medical patches requires high performance electronics capability.The problem is that these new technologies must ...

    SBIRPhase II2014Department of Defense Air Force
  4. FleX-3D Wafer Processing for Chip Stacking and Interconnect

    Amount: $149,977.00

    Reliable, readily-manufacturable technologies are needed to create the next generation of high-density, high-functionality 3D integrated circuits (ICs) for integrating silicon pixel detectors with CMO ...

    SBIRPhase I2013Department of Energy
  5. A 45 nm Low Cost, Radiation Hardened, Platform Based Structured ASIC

    Amount: $124,926.00

    The proposed 45 nm radiation hardened platform based structured ASIC architecture offers the performance and density expected of a custom ASIC with the low manufacturing cost associated with a structu ...

    SBIRPhase I2012National Aeronautics and Space Administration
  6. Conformal Load Bearing Antenna Structure

    Amount: $149,990.00

    ABSTRACT: American Semiconductor will develop and demonstrate structural integration of a conformal load bearing antenna structure (CLAS). Future aircraft will incorporate distributed electronics, s ...

    SBIRPhase I2012Department of Defense Air Force
  7. Next-Generation Detector and Imager Development

    Amount: $999,954.00

    Existing silicon on insulator (SOI) pixel detectors which integrate single gate transistors with substrate diodes are limited by two key problems. First, the SOI transistor performance is degraded by ...

    SBIRPhase II2011Department of Energy
  8. Ultra Low Power, Radiation Hardened, Reconfigurable Analog-to-Digital Converter

    Amount: $99,963.00

    The goal of this project is to develop an ultra low power (ULP), radiation hardened, reconfigurable analog-to-digital converter (ADC) in the 130nm Flexfet Independently Double Gated SOI CMOS process. ...

    SBIRPhase I2011Department of Defense Missile Defense Agency
  9. High Performance, Ultra Low Power SPA-1 ASIC for Space Plug-and-Play Avionics

    Amount: $749,365.00

    ABSTRACT: The Space Plug-and-play Avionics (SPA) initiative is designed to improve the ability of the US military to respond to rapidly changing operational needs by creating, integrating, and launch ...

    SBIRPhase II2011Department of Defense Air Force
  10. Ultra Low Power, High Performance Microprocessor Core for Military and Space Applications

    Amount: $99,869.00

    For Phase I, an ultra low power, high performance microprocessor core using a combination of double-gated and independent double-gated Flexfet™ SOI CMOS technology from American Semiconductor will b ...

    SBIRPhase I2010Department of Defense Air Force
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