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Company Information:

Company Name:
Aguila Technologies, Inc.
Address:
310 Via Vera Cruz, Suite 107
San Marcos, CA 92078-
Phone:
(760) 752-1199
URL:
N/A
EIN:
330719762
DUNS:
957992522
Number of Employees:
9
Woman-Owned?:
Yes
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $2,028,873.00 25
SBIR Phase II $7,189,761.00 11
STTR Phase I $273,613.00 4
STTR Phase II $3,561,227.00 3

Award List:

A Reliable Method for Direct Chip Attach for Mixed Technology Integration

Award Year / Program / Phase:
1997 / SBIR / Phase I
Award Amount:
$60,000.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Sherry Chu
Abstract:
The emergence of compact products employing mixed technologies, such as personal digital assistants, wireless communicators and sensor systems, is creating a host of new needs in electronics packaging. These products are driven by small size, light weight, high-operating frequencies, unique… More

Revolutionary Epoxy Technology for High Tg MCM Substrates

Award Year / Program / Phase:
1997 / SBIR / Phase I
Award Amount:
$100,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Z. Zhou
Abstract:
The goal of this program is the development of low cost, low viscosity and high performance epoxy resins cured by a novel method, for use in multichip modules (MCM) substrates. The revolutionary epoxy resin, invented by the principle investigator of this proposal, has very high temperature… More

A Reliable Method for Direct Chip Attach for Mixed Technology Integration

Award Year / Program / Phase:
1998 / SBIR / Phase II
Award Amount:
$140,000.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Sherry Chu
Abstract:
The emergence of compact products employing mixed technologies, such as personal digital assistants, wireless communicators and sensor systems, is creating a host of new needs in electronics packaging. These products are driven by small size, light weight, high-operating frequencies, unique… More

Revolutionary Epoxy Technology for High Tg MCM Substrates

Award Year / Program / Phase:
1998 / SBIR / Phase II
Award Amount:
$1,000,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Z. Zhou
Abstract:
The goal of this program is the development of low cost, low viscosity and high performance epoxy resins cured by a novel method, for use in multichip modules (MCM) substrates. The revolutionary epoxy resin, invented by the principle investigator of this proposal, has very high temperature… More

UV Imageable Thermosetting Polymers for Opticla Waveguides

Award Year / Program / Phase:
1998 / SBIR / Phase I
Award Amount:
$65,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Dr. Ligui Zhou
Abstract:
The objective of this effort is to create new, low-cost, UV-imageable/thermosetting polymers for optical waveguides printed circuits that can be fabricated using conventional printed wire board fabrication processes. Benefits of these new polymers are (a) adjustable refractive in-dices. (b) high… More

SBIR Phase I: Synthesis of Sinterable Nanophase Materials for Low-Cost Manufacturing of Multichip Mo

Award Year / Program / Phase:
1998 / SBIR / Phase I
Award Amount:
$100,000.00
Agency:
NSF
Principal Investigator:
Sherry Chu
Abstract:
N/a

Nano-Engineered Magnetic Materials for High Temperature Operation

Award Year / Program / Phase:
1999 / SBIR / Phase I
Award Amount:
$100,000.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Sherry Zhu
Abstract:
N/a

N/A

Award Year / Program / Phase:
1999 / SBIR / Phase II
Award Amount:
$400,000.00
Agency:
NSF
Principal Investigator:
Sherry Chu
Abstract:
N/a

High Performance Nanocomposites for Extreme Thermal Environments

Award Year / Program / Phase:
1999 / SBIR / Phase I
Award Amount:
$65,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Sherry Zhu
Abstract:
N/a

Spray-On, Low Temperature Sintered Metallic Coatings For Electromagnetic Shielding

Award Year / Program / Phase:
1999 / SBIR / Phase I
Award Amount:
$65,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
M Albert Capote
Abstract:
N/a

N/A

Award Year / Program / Phase:
1999 / STTR / Phase I
Award Amount:
$0.00
Agency:
NASA
Principal Investigator:
Research Institution:
University of California
RI Contact:
N/A
Abstract:
N/a

Robust MCM Packaging Technology for Space Systems

Award Year / Program / Phase:
1999 / SBIR / Phase I
Award Amount:
$69,981.00
Agency:
NASA
Principal Investigator:
Sherry Zhu, Member of the Technical Staff
Abstract:
N/a

N/A

Award Year / Program / Phase:
2000 / SBIR / Phase I
Award Amount:
$0.00
Agency:
NASA
Principal Investigator:
Sherry Zhu, Member of the Technical Staff
Abstract:
N/a

N/A

Award Year / Program / Phase:
2000 / SBIR / Phase II
Award Amount:
$599,937.00
Agency:
NASA
Principal Investigator:
Sherry Zhu, Member of the Technical Staff
Abstract:
N/a

Spray-On, Low Temperature Sintered Metallic Coating for Electromagnetic Shielding

Award Year / Program / Phase:
2001 / SBIR / Phase II
Award Amount:
$500,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
M.Albert Capote, Principal Investigator
Abstract:
There is an emerging need within military electronics for protection of electronics from the adverse effects of high power electromagnetic radiation. The Department of Defense has a requirement to ensure survivability of important military C3 and weaponssystems against the effects of… More

Improving Electronic Circuit and System Reliability Using Embedded Prognostics

Award Year / Program / Phase:
2001 / SBIR / Phase I
Award Amount:
$100,000.00
Agency:
DOE
Principal Investigator:
Robert V. Burress, Director of Advanced Packing Program
Abstract:
65672 Manufacturing methods for CdZnTe gamma and x-ray pixel detectors, used in medical imaging, are relatively immature. One difficulty with CdZnTe as a detector material is that CdZnTe is more brittle than silicon, so standard bonding approaches frequently result in craters in the detector as… More

Thermally-Conductive Polymer Nanocomposite Adhesives

Award Year / Program / Phase:
2001 / SBIR / Phase I
Award Amount:
$65,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Alan Grieve, Principal Investigator
Abstract:
The principal technology for removing heat from a device remains thermal conduction. In direct chip attach applications the primary path for heat is through the gap between the chip and a heat dissipation device. The thermal properties of the adhesivesthat fill that gap are increasingly dictating… More

Hermetic-Equivalent Wafer-Scale Packaging of Radiation-Hardened Semiconductors for Use In Strategic Missile Guidance Systems

Award Year / Program / Phase:
2002 / SBIR / Phase II
Award Amount:
$599,862.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Robert Burress, Director Advanced Packagi
Abstract:
"Guidance systems used on sea-based vehicles are often stored forlong periods of time (10 to 30 years) under a variety ofuncontrolled storage and operational conditions. The electronicsare util-ized during the life of the system and must operate witha high degree of reliability when they are needed.… More

Hermetic-Equivalent Wafer-Scale Packaging of Radiation-Hardened Semiconductors for Use In Strategic Missile Guidance Systems

Award Year / Program / Phase:
2002 / SBIR / Phase I
Award Amount:
$0.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Robert Burress, Director Advanced Packagi
Abstract:
"Guidance systems used on sea-based vehicles are often stored forlong periods of time (10 to 30 years) under a variety ofuncontrolled storage and operational conditions. The electronicsare util-ized during the life of the system and must operate witha high degree of reliability when they are needed.… More

Development of High Temperature Barrier Coating

Award Year / Program / Phase:
2002 / SBIR / Phase I
Award Amount:
$70,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Y. Joon Lee, Member, Technical Staff
Abstract:
"The object of this proposal is a cost-effective coating to be used to guard bulkheads and other naval structures from exposure to high-temperatures during a fire event. Material is to be capable of withstanding the action of a flame while preventing thecovered surface from reaching a temperature of… More

Thermal Management Techniques for Bonded Electronic Components

Award Year / Program / Phase:
2002 / SBIR / Phase I
Award Amount:
$70,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Alan Grieve, Principal Investigator
Abstract:
"There is a growing need for improvement in the performance of thermally-conductive polymeric adhesives used in the bonding of electronic structures for use in high-temperature environments, such as the operating environment of high power wide bandgapelectronic devices. Many polymeric adhesives for… More

NEXT GENERATION GAMMA DETECTOR ARRAYS FOR HIGH RESOLUTI*

Award Year / Program / Phase:
2002 / SBIR / Phase I
Award Amount:
$170,085.00
Agency:
HHS
Principal Investigator:
Abstract:
Proposed is advancement of the state-of-the-art pixilated solid state semiconductor gamma ray imaging array detector assemblies to where their advantages of energy and spatial resolution in a room temperature detector may be exploited with minimal cost and risk in applications such as large area… More

Low Temperature Sintered Conductive Adhesives for use in the Packaging of High-Power Electronics

Award Year / Program / Phase:
2003 / SBIR / Phase I
Award Amount:
$69,937.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Alan Grieve, Scientist, Technical Staf
Abstract:
There is a growing need for improvement in the performance of thermally and electrically conductive polymeric adhesives used in electronic packaging. In particular, there are few polymeric materials that are suitable for replacing eutectic solder bondingin electronic devices used in high-temperature… More

Solid State Gamma Ray Imaging Detectors, Novel Packaging

Award Year / Program / Phase:
2003 / SBIR / Phase I
Award Amount:
$100,000.00
Agency:
HHS
Principal Investigator:
Abstract:
DESCRIPTION (provided by applicant): Proposed is advancement of the state-of-the-art for pixilated Cadmium Zinc Telluride (CZT) gamma ray imaging array detector assemblies to where their advantages of energy and spatial resolution in a room temperature detector may be exploited with minimal cost and… More

Gamma Detector Modular Assemblies for EXIST

Award Year / Program / Phase:
2003 / SBIR / Phase I
Award Amount:
$70,000.00
Agency:
NASA
Principal Investigator:
Alber Capote, Principal Investigator
Abstract:
The Energetic X-ray Imaging Survey Telescope (EXIST) is a proposed mission that aims to detect faint high energy X-ray sources in the energy range 10 - 600 keV. The concept for EXIST relies on an X-ray telescope imaging the entire sky each 95 min orbit. The core of the X-ray imaging telescope… More

Gamma Detector Modular Assemblies for EXIST

Award Year / Program / Phase:
2004 / SBIR / Phase II
Award Amount:
$599,964.00
Agency:
NASA
Principal Investigator:
Alber M. Capote, Principal Investigator
Abstract:
The Energetic X-ray Imaging Survey Telescope (EXIST) is a proposed mission that aims to detect faint high energy X-ray sources in the energy range 10 - 600 keV. The concept for EXIST relies on an X-ray telescope imaging the entire sky each 95 min orbit. The core of the X-ray imaging telescope… More

High Resolution Digital Imaging X-ray Detectors

Award Year / Program / Phase:
2004 / STTR / Phase I
Award Amount:
$99,904.00
Agency:
HHS
Principal Investigator:
Research Institution:
UNIVERSITY OF CALIFORNIA SAN DIEGO
RI Contact:
N/A
Abstract:
DESCRIPTION (provided by applicant): The aim is to develop a high resolution, high contrast detector for digital x-ray imaging systems. The target detector would have a Detective Quantum Efficiency much greater than 80%, a limiting resolution of at least 10 lp/mm, ultra-low noise, linear response… More

Sintered Conductive Adhesives for use in Active Radar System Thermal Management

Award Year / Program / Phase:
2004 / SBIR / Phase I
Award Amount:
$70,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Alan Grieve, Principal Investigator
Abstract:
Current Naval microwave power amplifiers operate at power densities around 200-500 W/cm2. Amplifiers under development may operate at 2-4 times this power density. Despite the development of active cooling technologies, the principal technology for removing heat from a chip remains thermal… More

Practical Low-Cost High-Resolution Gamma Ray Sensor

Award Year / Program / Phase:
2004 / SBIR / Phase I
Award Amount:
$100,000.00
Agency:
HHS
Principal Investigator:
Abstract:
DESCRIPTION (provided by applicant): Propose to combine standard commercial CZT crystals and ASICS with Aguila Technologies' proprietary high-density CZT detector bonding methods and very dense electronic packaging capability to develop high resolution (less than 1 mm pixel pitch) imaging CZT… More

Low Temperature Sintered Conductive Adhesives for use in the Packaging of High-Power Electronics

Award Year / Program / Phase:
2005 / SBIR / Phase II
Award Amount:
$749,999.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Alan Grieve, Senior Scientist
Abstract:
There is a need for improvement in the performance of thermally and electrically conductive polymeric adhesives used in electronic packaging. In particular, there are few polymeric materi-als that are suitable for replacing eutectic solder bonding in electronic devices used in high-temperature… More

A Directional Gamma Auto Spectrometer

Award Year / Program / Phase:
2005 / SBIR / Phase I
Award Amount:
$99,994.00
Agency:
DHS
Principal Investigator:
M. Albert Capote, President – (760) 752-1199
Abstract:
The Government is deploying a growing number of radiation detectors at U.S. borders, ports of entry and other key locations, intended to assist in the detection of a potential terrorist`s nuclear explosive device or radiological dispersal device. The most widely deployed radiation detector products… More

High Resolution Digital Imaging X-ray Detectors

Award Year / Program / Phase:
2005 / STTR / Phase II
Award Amount:
$2,183,056.00
Agency:
HHS
Principal Investigator:
Research Institution:
N/A
RI Contact:
N/A
Abstract:
DESCRIPTION (provided by applicant): The aim is to develop a high resolution, high contrast detector for digital x-ray imaging systems. The target detector would have a Detective Quantum Efficiency much greater than 80%, a limiting resolution of at least 10 lp/mm, ultra-low noise, linear response… More

High-Speed, Low Power 256 Channel Gamma Radiation Array Detector ASIC

Award Year / Program / Phase:
2005 / SBIR / Phase I
Award Amount:
$69,878.00
Agency:
NASA
Principal Investigator:
M Albert Capote, Principal Investigator
Abstract:
Building on prior success in detector electronics, we propose to design and fabricate a 256 channel readout ASIC for solid state gamma radiation array detectors having a power consumption of less 100 microW/pixel, an event detection throughput of more than 10,000 events/sec, and a dynamic range of… More

Sintered Conductive Adhesives for use in Active Radar System Thermal Management

Award Year / Program / Phase:
2006 / SBIR / Phase II
Award Amount:
$600,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Alan Grieve, Principal Investigator
Abstract:
Current Naval microwave power amplifiers operate at power densities around 200-500 W/cm2. Amplifiers under development may operate at 2-4 times this power density. Despite the development of active cooling technologies, the principal technology for removing heat from a chip remains thermal… More

High-Speed Interconnects Over Copper Traces

Award Year / Program / Phase:
2006 / SBIR / Phase I
Award Amount:
$98,998.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
M. A. Capote, Principal Investigator
Abstract:
As technology trends towards higher system data rates with reduced size and cost, the ability to create high-speed electrical interconnections at low cost is becoming critical. High-speed I/O, integrated along with high I/O parallellicity, is allowing interconnects to achieve over 1Tb/s of total… More

Innovative Active Array Radar Sensor

Award Year / Program / Phase:
2006 / SBIR / Phase I
Award Amount:
$100,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Alan Grieve, Principal Investigator
Abstract:
Aguila Technologies, together with Sensis Corporation, proposes innovative and practical solutions for the assembly and thermal management of active phased array Transmit/Receive modules employing high power density wide bandgap electronic devices. Our approach involves mounting the wide bandgap die… More

Study of CdZnTe Electrode Interface and Fabrication Technology Development

Award Year / Program / Phase:
2006 / STTR / Phase I
Award Amount:
$103,709.00
Agency:
HHS
Principal Investigator:
Research Institution:
MONTANA STATE UNIVERSITY (BOZEMAN)
RI Contact:
N/A
Abstract:
DESCRIPTION (provided by applicant): In several recent PA's, the NIH has articulated a clear vision for the future of medical imaging systems a) enhanced spatial or temporal resolution, b) better sensitivity and specificity, c) multi-modality, and d) new functional or molecular imaging or… More

A Directional Gamma Auto Spectrometer

Award Year / Program / Phase:
2007 / SBIR / Phase II
Award Amount:
$1,250,000.00
Agency:
DHS
Principal Investigator:
M Albert Capote, President – (760) 752-1199
Abstract:
THIS IS A FAST TRACK PROPOSAL WITH SIGNIFICANT MATCHING FUNDS COMMITMENTS. The Government is deploying a growing number of radiation detectors at U.S. borders, ports of entry and other key locations, intended to assist in the detection of a potential terrorist`s nuclear explosive device or… More

Flip chip bonding of ICs for 100GHz operation

Award Year / Program / Phase:
2007 / STTR / Phase I
Award Amount:
$70,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
M. A. Capote, President
Research Institution:
UNIV OF CALIFORNIA
RI Contact:
Mark Rodwell
Abstract:
Using manufacturing techniques recently demonstrated at Aguila Technologies, we will develop an inexpensive technology and system for rapidly producing moderate-scale production quantities of re-workable flip chip assemblies with target operating rates up to 100 GHz. The approach involves using… More

CZT Surveillance Camera

Award Year / Program / Phase:
2007 / SBIR / Phase I
Award Amount:
$150,000.00
Agency:
DHS
Principal Investigator:
Bill Cardoso, VP of Technology – (760) 752-4362
Abstract:
The improved surveillance of radioactive sources used in hospitals, research centers, food irradiations plants and other fully legal and sanctioned industries is paramount to interrupt the terrorism value chain. This value chain relies on stealing radioactive sources from the legitimate before… More

Study of CdZnTe Electrode Interface and Fabrication Technology Development

Award Year / Program / Phase:
2007 / STTR / Phase II
Award Amount:
$878,171.00
Agency:
HHS
Principal Investigator:
Research Institution:
N/A
RI Contact:
N/A
Abstract:
Not avaiable.

High-Speed Interconnects Over Copper Traces

Award Year / Program / Phase:
2008 / SBIR / Phase II
Award Amount:
$749,999.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
M. A. Capote, President
Abstract:
As technology trends towards higher system data rates with reduced size and cost, the ability to create high-speed electrical interconnections at low cost is becoming critical. High-speed I/O, integrated along with high I/O parallellicity, is allowing interconnects to achieve over 1Tb/s of total… More