Fiscal Year:
2008
Title:
Ultra-Dense Three-Dimensional Electronics for Space
Agency / Branch:
DOD / USAF
Contract:
FA9453-08-M-0023
Award Amount:
$99,986.00
Abstract:
R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate Tezzaron's patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use Tezzaron's 3-D process to fabricate a prototype device.
Small Business Information at Submission:
R3LOGIC, INC.
30 Fuller Rd. Lexington, MA 02420
EIN/Tax ID:
043532571
DUNS:
N/A
Number of Employees:
Woman-Owned:
No
Minority-Owned:
No
HUBZone-Owned:
No