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Process Modeling for Additive Manufacturing of Alloys by Electron Beam

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-14-C-5021
Agency Tracking Number: F131-124-0204
Amount: $750,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: AF131-124
Solicitation Number: 2013.1
Timeline
Solicitation Year: 2013
Award Year: 2014
Award Start Date (Proposal Award Date): 2014-08-05
Award End Date (Contract End Date): 2016-08-01
Small Business Information
4401 Dayton-Xenia Road
Dayton, OH 45432-1894
United States
DUNS: 000000000
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 John Porter
 Principal Investigator
 (937) 426-6900
 jporter@ues.com
Business Contact
 Rick Weddle
Title: Director, Contracts
Phone: (937) 426-6900
Email: rweddle@ues.com
Research Institution
N/A
Abstract

ABSTRACT: UES proposes to develop a thermal model for additive manufacturing by electron beam melting that will enable selection of machine process parameters to maximize first part yield for arbitrarily shaped parts, and provide documentation to support rapid part qualification. The research will address manufacturing with Ti 6Al 4V and with Ti 6Al 2Sn 4Zr 2Mo using powder sources from different vendors. An experimental program has been designed to correlate change process parameter changes with microstructure while building shape elements that are representative of typical features within parts. The data obtained will be used to anchor the physics-based thermal model that will be developed as a commercial product. Aerospace partners have been identified that support such technology development for both engine and airframe parts. BENEFIT: The program is aimed at increasing the first part yield of additively manufactured parts manufactured by electron beam melting, and providing part metadata for part validation documentation. A successfully developed thermal model will be commercialized or licensed to users of EBM machines.

* Information listed above is at the time of submission. *

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