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Development and Processing of Dielectric Films for Application in Large Wound Capacitors

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-14-C-0096
Agency Tracking Number: N121-095-0999
Amount: $730,976.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N121-095
Solicitation Number: 2012.1
Timeline
Solicitation Year: 2013
Award Year: 2014
Award Start Date (Proposal Award Date): 2014-04-03
Award End Date (Contract End Date): 2016-12-31
Small Business Information
7700 Hub Parkway
Valley View, OH 44107
United States
DUNS: 961869364
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Deepak Langhe
 Sr. Research Scientist
 (216) 264-4818
 dlanghe@polymerplus.net
Business Contact
 Michael Ponting
Title: President
Phone: (216) 264-4819
Email: mponting@polymerplus.net
Research Institution
N/A
Abstract

Current state-of-the-art biaxially oriented polypropylene (BOPP) polymer film capacitors exhibit excellent room temperature performance, but show significant deterioration in properties above 85 C. In Phase I, poly(vinylidene fluoride) (PVDF) and polycarbonate (PC) multilayer films were found to demonstrate excellent room temperature and high temperature performance. The viability of the technology for large-scale film process development on a near commercial coextrusion facility was also demonstrated in Phase I. In Phase II, PolymerPlus LLC will optimize these PVDF/PC films by studying the effect of processing variables on film morphology and dielectric properties, downselect and process multilayered films for prototype capacitor fabrication, fabricate demonstrative prototype capacitors, and develop a manufacturing process which is ready for scale up to commercial operation. The specific goal of Phase II is to deliver several 10-joule capacitors with 1 kHz discharge time, high temperature performance (up to 120 C) and a wound capacitor energy density of 2 J/cc. Other high temperature polymers will also be investigated to expand the film storage capability of the technology, which will allow for broader acceptance in capacitor applications.

* Information listed above is at the time of submission. *

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