Reworkable Epoxy Bonding for Superconductor Multi-chip Modules

HYPRES, in collaboration with University of Arkansas (UA), proposes to develop a method for manufacturing superconductor multi-chip modules (MCMs) using nano-engineered cryogenic adhesives. A superconductor MCM comprises a carrier and several flipped chips. Before final assembly on the carrier, these chips need to be screened by temporarily attaching each one to another carrier with active test circuitry. Therefore, a detachable die attachment process is needed for selecting a set of known good die. This was achieved in Phase I and will be further refined in Phase II to ensure high reliability and robustness. Furthermore, a new method of selective detachment and replacement of a single chip from an MCM will be developed in Phase II. MCMs of increasing complexity will be developed for different target naval applications including multi-input RF receivers.