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Company Information:

Company Name:
Abj Integration Technologies,
Address:
7550 Chaparral Dr.
Atlanta, GA 30350
Phone:
N/A
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
2
Woman-Owned?:
Yes
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $225,351.00 3

Award List:

Self-routing Optical Crossbar Switch

Award Year / Program / Phase:
1993 / SBIR / Phase I
Award Amount:
$56,653.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Axel Thomsen
Abstract:
High speed, low cost optical self routing optical crossbar switches with gigabit data rates are key components in optical communication and routing systems. We propose to fabricate and study a monolithically integrated optical crossbar switch which will be inexpensive and high performance. This… More

Optical Link for Cryogenic FPA Readout Using Si Circuitry and Thin Film Emitters, Detectors, and Modulators

Award Year / Program / Phase:
1995 / SBIR / Phase I
Award Amount:
$69,685.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Myunghee Lee
Abstract:
Standard Digital CMOS silicon circuits will have high quality Thin Film emitters, and modulators integrated on to the silicon using epitaxial liftoff and results in low cost opto-electronics in the near future. ABJ Integration is a leader in the field and proposes to design an optimized FPA readout… More

Optoelectronic Packaging for Through-Substrate Communications

Award Year / Program / Phase:
1997 / SBIR / Phase I
Award Amount:
$99,013.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Jeff Cross
Abstract:
ABJ Integration Technologies, Inc. proposes to model a vertically optically interconnected stack of silicon integrated circuits to form a three dimensional system. This 3D system will utilize through-substrate optoelectronic communication to which the package and silicon are optically transparent. … More