Design and Fabrication Techniques for 3-Dimensional Integrated Circuits

The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applications in the system on a chip design space. Currently, CAD tools for 3-D integration are severely lacking stagnating potentially explosive growth of the technology. GoofyFoot Labs proposes TESI3d, a CAD tool to efficiently and accurately explore the complex 3-D design space. We will develop a full-scale prototype, which will then be used to design and evaluate 3-D systems.