Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics
Agency / Branch:
DOD / USAF
ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to transform high heat flux (e.g. 100-300W/cm2) at the device package to a lower heat flux at the heat sink areas - and do so with minimal thermal resistance. Deliverables at conclusion of two-year effort will include a demonstration OHP-based chip carrier prototype attached to simulated real chip(s) on test board with integrated heat sink. BENEFIT: The expected benefit of this proposed Phase II effort is the deployment of higher power processors aboard satellite payloads. Such an enabling technology will be applicable commercial and military satellite applications, as well as terrestrial ones with ultra-high heat flux and/or constrained heat rejection rates.
Small Business Information at Submission:
ThermAvant Technologies, LLC
1000 A Pannell Street Columbia, MO -
Number of Employees: