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Thermal Management Improvements for Transmit/Receive Modules
Title: Manager, Custom Products
Phone: (717) 295-6105
Email: Richard.Bonner@1-act.com
Title: Accounting Clerk
Phone: (717) 295-6092
Email: Frank.Morales@1-act.com
This Small Business Innovation Research (SBIR) Phase I project will develop and demonstrate a thermal ground plane (TGP) technology with improved manufacturability and reliability over previous technology generations. Advanced Cooling Technologies, Inc. is developing ultra low thermal resistance and high heat flux wick structures to improve thermal performance in TGP's used to cool electronic systems. The advanced TGP's further consist of ceramic materials with coefficients thermal of expansion (CTE's) closely matching those common semiconductor materials. The CTE matching feature allows the TGP to be soldered directly to the semiconductor device using standard manufacturing practices, which helps to minimize the thermal interface resistance between the TGP and the semiconductor device.
* Information listed above is at the time of submission. *