Not Available The primary goal of Phase I work will be to demonstrate the feasibility of growing high quality, high purity, stoichiometric ZnO bulk crystals from a seeded melt. The secondary goal will be to stabilize the ZnO, thereby improving the stability of the ZnO lattice in reducing… More

This phase-I effort seeks to demonstrate the feasibility of developing a coating removal method based on a novel, environmentally-friendly (chemical-free and energy efficient) technology known as Acoustic Coaxing Induced Microcavitation (ACIM). InACIM-based technologies silent sound is used to… More

This Small Business Innovation Research (SBIR) Phase II project will develop an optimized prototype of the UNCOPIER-a chemical-free, energy-efficient, ACIM-based device designed to non-destructively deink laser-xerographic prints one sheet at a time. Acoustic Coaxing Induced Microcavitation (ACIM)… More

This Small Business Innovation Research (SBIR) Phase II project will develop an optimized prototype of the UNCOPIER-a chemical-free, energy-efficient, ACIM-based device designed to non-destructively deink laser-xerographic prints one sheet at a time. Acoustic Coaxing Induced Microcavitation (ACIM)… More

This Small Business Innovation Research (SBIR) Phase I project is to save semiconductor wafers from being deeply scratched by unchecked large errant particles in chemical mechanical planarizing or polishing (CMP) slurries. CMP has become the method of choice for restoring the surface trueness of… More

This Small Business Innovation Research (SBIR) Phase I project will develop a new method of measuring how strongly a thin film anchors to its substrate. To date no method exists that can truly measure thin film adhesion. The Acoustic Coaxing Induced Microcaviation (ACIM) deBonder uses controlled… More

This Small Business Innovation Research Phase I project is targeted to save semiconductor wafers from being deeply scratched by unchecked large errant agglomerates in chemical mechanical planarizing or polishing (CMP) slurries. CMP has become the method of choice for restoring the surface trueness… More

This Small Business Innovation Research (SBIR) Phase II project will develop a new method of determining how strong a thin film anchors to a substrate. The ACIM deBonder(trade mark)uses controlled microcavitation to directly reveal a thin film's adhesion strength by subjecting it to controlled… More

This Small Business Innovation Research (SBIR) Phase I project concerns Ultrapure Water (UPW), the lifeblood of the semiconductor industry. The proposed instrument seeks to satisfy the International Technology Roadmap for Semiconductors (ITRS) requirements on two counts: 1. full flow inspections, 2.… More

This Small Business Innovation Research (SBIR) Phase I Project seeks to develop an innovative method for removing resist from semiconductor wafers. The Microcavitation Resist Remover will help enable the low-k integration critical to the next generation of faster chips. Microcavitation will be a… More

This Small Business Innovation Research (SBIR) Phase II Project concerns Ultrapure Water (UPW), the life blood of the semiconductor industry. The proposed instrument seeks to satisfy the ITRS requirements on two counts: 1. full flow inspection, and 2. detection of sub-100nm liquid-borne particles.… More

This SBIR Phase I project is to develop a Chemical Mechanical Polishing (CMP) Slurry Monitor as a fully in-line, real-time, point of use instrument that will detect and disperse large agglomerates in the nanofine slurries used in IC manufacture. The monitor will not only detect scratch inducing… More

The Small Business Innovation Research (SBIR) Phase II project seeks to develop an innovative, environment friendly method for removing resist from semiconductor wafers. After every lithography step, and the following processing step, e.g., etching or ion implantation, the process-hardened resist… More

This Small Business Innovation Research (SBIR) Phase I project, will develop a new kind of wafer cleaning tool that will be useful at every cleaning step in semiconductor processing. It will use an environmentally friendly, acoustic technology that uses only clean water and silent sound. The tool… More

This SBIR Phase-I project is to develop an acoustic CMP (Chemical Mechanical Polishing) slurry monitor?a fully in-line, real-time, point of use instrument that will detect and disperse any and all large agglomerates in the nanofine slurries used in IC manufacture. Left unchecked, these errant slurry… More

This Small Business Innovation Research (SBIR) Phase II project aims to develop a single wafer processing clean tool for semiconductor wafer cleaning at all stages of wafer processing. The method relies on using acoustically controlled micro-cavitation to remove on-wafer particles. This is a… More