AUOTMATED VIBRATION AND THERMAL ANALYSIS OF ELECTRONIC DEVICES

AN AUTOMATED VIBRATION AND THERMAL ASSESSMENT OF ELECTRONIC DEVICES USING CLOSED FORM PROCEDURES IS PROPOSED. IT WILL ADDRESS MECHANICAL DESIGN THAT IS CONSISTANT WITH SIMPLIFIED ANALYSIS. DESIGNS THAT DEPEND ON FUNDAMENTAL LARGE FEATURE WILL PASS THE ASSESSMENT. PROBLEM FEATURES CAN QUICKLY BE IDENTIFIED FOR A MORE FORMAL FINITE ELEMENT OR FINITE DIFFERENCE SCHEME TO SIMULATE ALL CONTRIBUTING EFFECTS FOR AN ACCEPTABLE CONFIGURATION. THE SIMPLIFIED ANALYTICAL TECHNIQUES WOULD BE USED WITH DATA INPUT BY AN INTERACTIVE COMPUTER FORMAT. PHASE I WILL DEMONSTRATE TECHNICAL PROOF OF CONCEPT USING A COMPUTER CODE THAT CARRIES OUT SIMPLIFIED DYNAMIC AND THERMAL ANALYSIS. PHASE II WILL DEVELOP A CODE THAT CAN ANALYZE A WIDE VARIETY OF ELECTRONIC DEVICES AND SUBSYSTEMS.