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Broadband Multichannel Slipring

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N65538-05-M-0157
Agency Tracking Number: N051-058-0104
Amount: $99,984.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N05-058
Solicitation Number: 2005.1
Timeline
Solicitation Year: 2005
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-05-11
Award End Date (Contract End Date): 2005-11-10
Small Business Information
Photonic Systems Division, 20600 Gramercy Place, B
Torrance, CA 90501
United States
DUNS: 153865951
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Naibing Ma
 Team Leader, Optical Devices
 (310) 320-3088
 sutama@poc.com
Business Contact
 Gordon Drew
Title: Chief Financial Officer
Phone: (310) 320-3088
Email: gdrew@poc.com
Research Institution
N/A
Abstract

To address the U.S. Navy need for a robust, reconfigurable, high-speed communication system to transfer data between remote sensors and inboard processing equipment aboard submarines, Physical Optics Corporation (POC) proposes to develop a new Broadband Multichannel Slipring (BMCS). This proposed device is based on a Fiber Optic Rotary Joint (FORJ), time division multiplexing (TDM), wavelength division multiplexing (WDM), and roll-ring technologies. It will include a three-channel FORJ, a three-channel roll-ring electrical slipring, and a three-channel RF coupler. The BMCS will simultaneously transfer analog/digital, optical, and electrical signals/data at high speeds/data rates, it will be lightweight and compact, durable, reliable, and maintenance-free, with wide bandwidth, low loss, and high security. The novel BMCS is bidirectional and freely rotating. In Phase I POC will demonstrate the feasibility of transmitting multiple data, audio/video, and sensing signals through a prototype BMCS at high speed between a stationary base and a rotary platform. In Phase II POC plans to fully develop a BMCS to replace current Navy copper-based rotary joints with sufficient capacity for future sensors.

* Information listed above is at the time of submission. *

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