Optical Integrated Optics Interconnects for MCMs 3-D Structures

Physical Optics Corporation (POC), Applied Technology (AT) Division, proposes to develop a unique photonic interconnect technology that is capable of high bandwidth data and signal communications for high performance systems based on MCM technology. POC's proposed photonic interconnect technology will drastically reduce the number of physical interconnects required among the MCM modules by multiplexing the digital and analog signals on a single optical communication line. POC's proposed MCM interconnect architecture will make use of optical waveguides. In the inter-MCM (MCM-to-MCM) interconnect architecture, each MCM board can communicate by optical means through the intermediate optically active layer. These plates will be interconnected using a micro-mirror monolithic approach for static coupling of the single-mode polymeric waveguides. The optically active polymer-based channel waveguides can be fabricated on any optoelectronic substrate, including GaAs, Si, A12O3. BeO, AIN, quartz, PC boards, glass, fused silica, and many different metallic surfaces.