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POLYMER-BASED OPTICAL DATA BUS FOR HIGH-SPEED DATA ACQUISITION SYSTEMS

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: N/A
Agency Tracking Number: 21703
Amount: $300,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1995
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
20600 Gramercy Pl Ste 103
Torrance, CA 90501
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert Shih
 (310) 320-3088
Business Contact
Phone: () -
Research Institution
N/A
Abstract

RESEARCHERS ARE DEVELOPING A POLYMER-BASED OPTICAL DATA BUS FOR HIGH-SPEED INTERCONNECTIONS FOR USE IN DATA PROCESSING AND PHYSICAL MEASUREMENT SYSTEMS. THE CONCEPT PROVIDES AN OPTICAL DATA BUS (ODB) COMPATIBLE WITH WIDELY USED MODULE INTERCONNECTION STANDARDS (E.G., CAMAC, FASTBUS, VMEBUS) WHILE IMPROVING COMMUNICATION SPEED AND PARALLELITY. RESEARCHERS ARE USING A HIGH-SPEED POLYMER-BASED ODB FOR CHIP-TO-CHIP, INTRAMODULE, AND MODULE-TO-MODULE INTERCONNECTION. THE TWO-DIMENSIONAL TUNABILITY OF THE REFRACTIVE INDEX OF THE POLYMER MICROSTRUCTURE PROVIDES THE CAPABILITY TO MAKE A MICROSTRUCTURED CHANNEL WAVEGUIDE ON ANY SUBSTRATE OF INTEREST. THIS CHARACTERISTIC PROVIDES AN EASY MEANS OF CONSTRUCTING OPTICAL BACKPLANES AND PRINTED ODB BOARDS FOR SYSTEM-WIDE COMMUNICATION. THE HOST MATERIAL CAN BE USED TO INTRODUCE NONLINEAR OPTICAL MOIETY IN A GUEST/HOST POLYMER SYSTEM FOR THE HIGHLY PARALLEL PROCESSING NEEDED FOR FASTBUS INTERCONNECTIONS. THE POLYMER ODB IS IMMUNE TO EMI AND NUCLEAR RADIATION. AS A RESULT, RADIATION HARDNESS IS EXPECTED. A BOARD-TO-BOARD ODB SYSTEM THROUGH A BACKPLANE IS DEMONSTRATED. IT HAS SPEED AND COMMUNICATION DISTANCES BEYOND ANY CONVENTIONAL ELECTRONIC SYSTEM-WIDE INTERCONNECTIONS.

* Information listed above is at the time of submission. *

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