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OPTICAL MANIPULATION AND DISTRIBUTION OF MICROWAVE SIGNALS

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 15934
Amount: $51,345.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1991
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
20600 Gramercy Pl - Ste 103
Torrance, CA 90501
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr Ray Chen
 Principal Investigator
 (213) 530-1416
Business Contact
Phone: () -
Research Institution
N/A
Abstract

WE PROPOSE A NOVEL OPTOELECTRONIC DEVICE COMBINATION AS A POWERFUL AND UNIVERSAL MEANS TO OPTICALLY MANIPULATE AND THEN DISTRIBUTE MICROWAVE SIGNALS. IN CONTRAST TO ANY KNOWN WAVEGUIDE FABRICATION METHOD SUCH AS ION-EXCHANGE, METAL-INDIFFUSION, OR MOLECULAR BEAM EPITAXY, WE PROPOSE A REFRACTIVE INDEX TUNING METHOD TO CONSTRUCT A LOW COST POLYMER WAVEGUIDE ON ANY SURFACE, INCLUDING SEMICONDUCTORS, CONDUCTORS, AND INSULATORS. THE TUNING METHOD WILL BE RESEARCHED DURING THE PHASE I PROGRAM TO MINIMIZE THE WAVEGUIDE PROPAGATION LOSS. PLAUSIBILITY OF GENERATING A POLYMER WAVEGUIDE MODULATOR AND FABRICATING MICROPRISMS (\ 100 UM) OF ARBITRARY SHAPES WILL ALSO BE DEMONSTRATED. THE PROPOSED MODULATOR HAS A SIMILAR ELECTRODE STRUCTURE TO THAT OF A TRAVELING WAVE DEVICE; THEREFORE, ULTRA-HIGH SPEED IS EXPECTED. THE PROPOSED CONCEPT IS AN EXTREMELY POWERFUL TOOL FOR INTRACHIP, CHIP-TO-CHIP, AND BOARD-TO-BOARD HIGHLY PARALLEL INTERCONNECTS (E.G., FIBER OPTIC DELAY LINES FOR PHASED ARRAY ANTENNAS). THERE IS CURRENTLY NO PRACTICAL WAY TO COUPLE LIGHT FROM SINGLE-MODE WAVEGUIDES TO MULTI-MODE FIBERS (50/125,62.5/125,100/140). THE POLYMER WAVEGUIDE/MICROPRISM ARRAY APPROACH CAN SOLVE THIS INTERFACE PROBLEM. AN INTERCONNECTION SYSTEM SUITABLE FOR ARMY PHASED ARRAY ANTENNAS WILL BE INVESTIGATED IN PHASE I AND THEN DEVELOPED IN PHASE II AND III.

* Information listed above is at the time of submission. *

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