INSULATION OF IMPLANT DEVICES BY PLASMA POLYMER COATINGS

Award Information

Agency: Department of Health and Human Services

Branch: N/A

Contract: N/A

Agency Tracking Number: 11315

Amount: $493,763.00

Phase: Phase II

Program: SBIR

Solicitation Topic Code: N/A

Solicitation Number: N/A

Timeline

Solicitation Year: N/A

Award Year: 1991

Award Start Date (Proposal Award Date): N/A

Award End Date (Contract End Date): N/A

Small Business Information

Nichols Technologies Inc.

Research Pk Box 1759

Columbia, MO 65205

United States

DUNS: N/A

HUBZone Owned: No

Woman Owned: No

Socially and Economically Disadvantaged: No

Principal Investigator

Phone: () -

Business Contact

Phone: () -

Research Institution

N/A

Abstract

THE LONG-TERM OBJECTIVE OF THIS RESEARCH IS TO PROVIDE A COMMERCIAL FACILITY AND REACTORS FOR THE PRODUCTION OF THIN POLYMER HERMETIC INSULATING MATERIALS SPECIFICALLY DEVELOPED FOR THE PHYSIOLOGICAL ENVIRONMENT AND FOR THE PREVENTION OF ELECTROLYTIC CORROSION OF INTEGRATED CIRCUIT METALLIZATIONS AND LEAD WIRES. THE METHODS OF POLYMER FORMATION BY PLASMA POLYMERIZATION AND VACUUM-BAKE TECHNOLOGY WILL BE UTILIZED TO PREPARE SURFACES, PROVIDE INTERMEDIATE LAYERS FOR COMPOSITE FILM ENCAPSULATION, AND REDUCE THE NUMBER OF ENCAPSULANT PROCESSING STEPS CURRENTLY IN USE. SPECIFICALLY, THIS RESEARCH WILL DETERMINE IF PLASMA REACTOR CONDITIONS OPTIMIZED FOR ADHESION CAN BE COMBINED WITH VACUUM-BAKE TECHNOLOGY TO REDUCE THE MOISTURE CONTENT AND IMPROVE THE ENCAPSULATION OF MOS INTEGRATED CIRCUIT DEVICES. IN ADDITION, THE CORRELATION OF PLASMA POLYMERIZATION ENERGY PARAMETERS AND CORROSION PROTECTION OF CIRCUIT METALLIZATIONS AND BOND WIRES WILL BE INVESTIGATED.

* Information listed above is at the time of submission. *

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INSULATION OF IMPLANT DEVICES BY PLASMA POLYMER COATINGS