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00-003B-Radar and MMW: Inkjet Print Self-Assembly of Multifunctional Devices on Flexible Nanosat Surfaces

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG6003C0096
Agency Tracking Number: 02-0783
Amount: $750,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2003
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
P.O. Box 618
Christiansburg, VA 24068
United States
DUNS: 008963758
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Keith Huie
 Research Scientist-Group
 (540) 953-1785
 khuie@nanosonic.com
Business Contact
 Richard O.Claus
Title: President
Phone: (540) 953-1785
Email: roclaus@nanosonic.com
Research Institution
N/A
Abstract

The objective of the proposed MDA Phase II program is to develop the capabilities to manufacture next-generation radio frequency (RF) and microwave device components relevant to the design of a phased array antenna system onto flexible and easily formablesubstrates using low-cost inkjet print self assembly methods. A rapid and continuous fabrication approach, inkjet self assembly printing will benefit the MDA by providing improvement in the time, flexibility, and cost of fabricating prototype testelements as well as complete deliverable systems, which are of primary importance for both military and commercial applications. In particular, this nanotechnology fabrication approach would serve as an advantageous replacement to conventional productionprocesses used to pattern low-profile microstrip/stripline device components on both flexible and semi-rigid substrates. During the Phase II program, NanoSonic would work with a major U.S. defense contractor to design, fabricate, and characterize theelectromagnetic performance of the inkjet printed deliverable prototypes. NanoSonic will continue cooperation with that U.S. defense contractor during Phase III to scale-up the inkjet print process manufacturing of large-scale device products.

* Information listed above is at the time of submission. *

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