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Nanotechnology Enabled Advanced Industrial Heat Transfer Fluids
Title: Dr.
Phone: (732) 868-1906
Email: gskandan@neicorporation.com
Title: Dr.
Phone: (732) 868-1906
Email: gskandan@neicorporation.com
78876S A heat transfer fluid with substantially higher heat transfer capabilties than state-of-the-art fluids would be of interest for closed-loop industrial waste heat recovery, as well as for general purpose industrial heat transfer. To date, the benefits from nanomaterial-enhanced industrial heat transfer fluids have not been realized, due to some significant technical issues. This project will develop nanoparticle-containing heat transfer fluids by manipulating the local environment at the fluid-nanoparticle interface through both physical and chemical means. The resulting nanoparticle-containing heat transfer fluid will have flow properties close to that of the base fluid, providing a substantial improvement in thermal conductivity and heat transfer coefficient. Phase I will: (1) synthesize two different nanoparticle compositions; (2) modify the surface of the nanoparticles to make them compatible with a commercial heat transfer fluid; (3) measure the thermal conductivity of the nanoparticle containing fluids; (4) alter the local field around the nanoparticles through physical means and measure changes in thermal conductivity; and (5) correlate the improvement in thermal conductivity with heat transfer coefficient. Commercial Applications and Other Benefits as described by the awardee: The nanoparticle-enabled heat transfer fluid should improve the energy efficiency of existing industrial waste heat recovery systems that utilize fluid flow in a closed-loop. The new fluids should find applications in large industrial operations such as refineries, chemical plants, and paper mills. The principles developed in this program also should be applicable to engine coolants, used in both off-road and consumer automotive applications, where weight and cost savings from smaller heat exchangers are important.
* Information listed above is at the time of submission. *