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ON-CHIP TEMPERATURE COMPENSATION FOR ADVANCED MMICS

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 6124
Amount: $50,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1987
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
465 E Easy St - Unit F
Simi Valley, CA 93065
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 WENDELL C PETERSEN
 (805) 584-6642
Business Contact
Phone: () -
Research Institution
N/A
Abstract

DEVELOPMENT OF EFFECTIVE ON-CHIP TEMPERATURE COMPENSATION FOR GAAS MMICS (MONOLITHIC MICROWAVE INTEGRATED CIRCUITS) IS OF VITAL IMPORTANCE TO THE IMPLEMENTATION OF THIS TECHNOLOGY IN MICROWAVE SYSTEMS. A PROGRAM TO DEVELOP ON-CHIP TEMPERATURE COMPENSATION TECHNIQUES FOR GAAS MMIC TECHNOLOGY IS DESCRIBED IN THIS PROPOSAL. USING THESE TECHNIQUES THE SYSTEM ENVIRONMENTAL REQUIREMENTS AND MMIC TECHNOLOGY CAPABILITIES ARE COMBINED TO OPTIMIZE PERFORMANCE WHILE MINIMIZING THECOST IMPACT ON PRODUCTION COMPONENTS AND SUBSYSTEM CHIPS. PHASE I OF THE PROPOSED PROGRAM CONCENTRATES ON THE ASSESSMENT AND DESIGN OF SEVERAL PROMISING ON-CHIP TEMPERATURE COMPENSATION TECHNIQUES. FABRICATION AND OPTIMIZATION OF THE COMPENSATION CIRCUITS IN PHASE II LEADS TO A WIDE RANGE OF POSSIBLE MMIC COMPONENTS SUITABLE FOR OPERATION IN THE HARSH ENVIRONMENTS COMMONLY ENCOUNTERED IN MOST MILITARY AND COMMERCIAL APPLICATIONS.

* Information listed above is at the time of submission. *

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