Thermal Management Techniques for Bonded Electronic Components

"This SBIR Phase I seeks to develop a family of unique highly thermally conductive diamond/epoxy composite adhesives for die attach of power electronic devices. Diamond has a conductivity of above 1800 W/m.K as compared to the conventional epoxy matrixwith a conductivity of 0.2 W/m.K. Hence the incorporation of the diamond filler particles with volume loading, Vf>50% can greatly increase the conductivity of the epoxy matrix to levels above 20-50 W/m.K, whilst retaining high bond strength and ease ofapplication. The most key innovation is to tailor the interface of the diamond particulate filler to allow acoustic coupling with the epoxy matrix for high conductivity by use of coating of the diamond with intermediate acoustic impedance layers with useof self-assembly coupling agents. High conductivity adhesives are essential for heat management in modern power electronic devices. The proposed innovation of using diamond filler will make thermal adhesives specifically for commercial high heat fluxapplications."