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Phase I Demonstration of a Heat Pump Loop Thermal Control System

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NAS9-01154
Agency Tracking Number: 013355
Amount: $69,999.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
200 Yellow Place
Rockledge, FL 32955
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert Scaringe
 Research Mechanical Engineer
 (321) 631-3550
 rps@mainstream-engr.com
Business Contact
 Kathy McGraw-Davids
Title: Comptroller
Phone: (321) 631-3550
Email: mkd@mainstream-engr.com
Research Institution
N/A
Abstract

Phase I will experimentally demonstrate the performance benefits of a Heat Pump Loop (HPL) Thermal Control Bus employing a unique working fluid which is not only non-toxic and environmentally-safe, but it will also survive the catalytic oxidizer on board spacecraft. Phase I will compare this unique system to pumped single-phase, pumped two-phase and heat pipe thermal control systems. Phase I will demonstrate a high-performance, environmentally-acceptable, manned-spacecraft-compatible heat pump loop thermal control system that exhibits the benefits of a two-phase pumped loop system, the thermal control and temperature lift of a heat pump augmented system, and the simplicity of a single-phase pumped loop system. Phase I will demonstrate that the HPL approach has the operational stability and flexibility to accommodate highly variable heat loads, variable radiator temperatures, and multiple cold-plate operating temperatures: That means increased thermal control flexibility for future spacecraft, and the possibility of a much more flexible and universal thermal bus. The Phase II effort would address coupling this technology with Mainstream's long life magnetic-bearing or oil-less compressor technology, coupling to compact high-temperature thermal storage devices, and fabrication of demonstration hardware for a Phase III flight test experiment.

* Information listed above is at the time of submission. *

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