You are here
Microelectromechanical Systems Packaging
Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-06-C-0160
Agency Tracking Number: A052-147-2000
Amount:
$119,992.00
Phase:
Phase I
Program:
SBIR
Solicitation Topic Code:
A05-147
Solicitation Number:
2005.2
Timeline
Solicitation Year:
2005
Award Year:
2006
Award Start Date (Proposal Award Date):
2006-01-29
Award End Date (Contract End Date):
2006-07-31
Small Business Information
120 East Union Avenue
Bound Brook, NJ
08805
United States
DUNS:
618971964
HUBZone Owned:
No
Woman Owned:
No
Socially and Economically Disadvantaged:
No
Principal Investigator
Name: Zhixiong Xiao
Title: Optical Engineer
Phone: (732) 648-8039
Email: LaserlithCo@aol.com
Title: Optical Engineer
Phone: (732) 648-8039
Email: LaserlithCo@aol.com
Business Contact
Name: Maisy Fong
Title: President
Phone: (732) 648-8039
Email: LaserlithCo@aol.com
Title: President
Phone: (732) 648-8039
Email: LaserlithCo@aol.com
Research Institution
N/A
Abstract
Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.
* Information listed above is at the time of submission. *