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SBIR Phase I: Epitaxial Metal Oxide Thin Films Using a Novel Polymer Assisted Deposition (PAD) Technique

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0740854
Agency Tracking Number: 0740854
Amount: $99,832.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AM
Solicitation Number: NSF 07-551
Timeline
Solicitation Year: N/A
Award Year: 2008
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
575 MCCORKLE BLVD
Westerville, OH 43082
United States
DUNS: 051815553
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mahavir Sanghavi
 MS
 (614) 891-2243
 msanghavi@lakeshore.com
Business Contact
 Mahavir Sanghavi
Title: MS
Phone: (614) 891-2243
Email: msanghavi@lakeshore.com
Research Institution
N/A
Abstract

This Small Business Innovation Research (SBIR) Phase I project will demonstrate method of depositing high density and reproducible epitaxial metal oxide thin films using a spin-on deposition technique. This method is not limited to the oxides, but can be used to deposit thin films of nitrides, carbides, and sulfides as well. The project will focus mainly on process development in which only a few selected metal oxides will be used. The thickness of the film's can be controlled over a wide range from few nanometers to several micrometers. The process is organic solvent-free and avoids typical problems encountered with sol-gel processes, which makes it attractive for commercialization. Both conducting and dielectric films can be deposited. The broader impact/commercial potential from this technology will be improved and lower cost manufacturing processes for thin films of simple or complex oxides, where Chemical Vapor Deposition (CVD) or sol-gel methods are currently used. The ability to deposit high-density epitaxial films without the need of expensive vacuum or CVD equipment could revolutionize the field of epitaxial coatings and lead to efficient devices, such as electronic devices, sensors and micro-actuators.

* Information listed above is at the time of submission. *

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