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Integration of Bulk GaN with Diamond for Device-level Thermal Management Solutions

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-08-C-0050
Agency Tracking Number: B073-034-0533
Amount: $99,992.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MDA07-034
Solicitation Number: 2007.3
Timeline
Solicitation Year: 2007
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-02-26
Award End Date (Contract End Date): 2008-08-25
Small Business Information
8829 Midway West Road
Raleigh, NC 27617
United States
DUNS: 020080607
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Drew Hanser
 CTO & VP Business Development
 (919) 789-8880
 hanser@kymatech.com
Business Contact
 Keith Evans
Title: CEO & President
Phone: (919) 789-8880
Email: evans@kymatech.com
Research Institution
N/A
Abstract

In this Phase I proposal, Kyma Technologies will perform a proof of concept demonstration of high quality bulk GaN/diamond integration for advanced thermal management of high power density GaN-based device applications. The development effort will include separation of thin GaN layers from bulk substrates and bonding to diamond.

* Information listed above is at the time of submission. *

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