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Company Information:
Name:
InterCAX, LLC
Address:
2402 Lively Trail
Atlanta, GA 30345-3837
Atlanta, GA 30345-3837
Located in HUBZone:
No
Woman-Owned:
No
Minority-Owned:
No
URL:
N/A
Phone:
(404) 894-4404
Award Totals:
Award List:
A Multi-Representation Architecture for STEP AP-210-based PCB Stackup Design and Warpage Analysis
Award Year / Program / Phase:
2005 / SBIR / Phase I
Agency / Branch:
DOC / NIST
Principal Investigator:
Award Amount:
$74,996.00
Abstract:
The objective of this Phase 1 effort is to demonstrate the feasibility of printed circuit assembly (PCA) warpage simulation through a novel combination of advanced AP210-based printed circuit board (PCB) simulation methods and cutting-edge general-purpose mesh generation tools. Our proposed… More
A Multi-Representation Architecture for STEP AP210-based PCB Stackup Design and Warpage Analysis
Award Year / Program / Phase:
2006 / SBIR / Phase II
Agency / Branch:
DOC / NIST
Principal Investigator:
Russell S. Peak
Award Amount:
$269,592.00
Abstract:
This effort creates foundations for highly automated simulation tools that predict warpage in printed circuit boards and assemblies (PCAs/PCBs) and chip packages. Our technique, MHS, provides core capabilities to automate warpage and other problems that were impractical until now. MHS extends a… More
Composable Mission Framework for Rapid End-to-End Mission Design and Simulation
Award Year / Program / Phase:
2009 / SBIR / Phase I
Agency:
NASA
Principal Investigator:
Manas Bajaj, Principal Investigator
Award Amount:
$100,000.00
Abstract:
The innovation proposed here is the Composable Mission Framework (CMF)ýýa model-based software framework that shall enable seamless continuity of mission design and simulation from early stage advanced studies to detailed mission design and development.
The uniqueness of our approach lies in… More
SLIM for Agile Mission Lifecycle Management
Award Year / Program / Phase:
2012 / SBIR / Phase I
Agency:
NASA
Principal Investigator:
Manas Bajaj, Principal Investigator
Award Amount:
$123,015.00
Abstract:
The principal technical innovation is SLIM (Systems LIfecycle Management), a software environment for integrated model-based systems engineering, combining SysML (OMG Systems Modeling Language) and PLM (Product Lifecycle Management) toolsets. The SysML model provides fine-grained federation of… More