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BURIED SILICIDE INTERCONNECTIONS WITH BONDED WAFERS

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 12586
Amount: $55,097.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1990
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
35 Cherry Hill Dr
Danvers, MA 01923
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr S N Bunker
 (508) 777-5110
Business Contact
Phone: () -
Research Institution
N/A
Abstract

COMPLEX MONOLITHIC INTEGRATED CIRCUITS ARE INCREASINGLY LIMITED BY THE NEEDS OF DEVICE INTERCONNECTIONS. EXISTING MATERIALS TAKE UP VALUABLE REAL ESTATE ON THE DIE, LIMIT CURRENT, AND ARE SUBJECT TO PARASITIC CAPACITANCES. THE USE OF MULTILEVEL AND 3D STRUCTURES HAS BEEN SUGGETED IN ORDER TO AVOID SOME OF THESE PROBLEMS. FORMATION OF CONDUCTORS BY ION IMPLANTATION SHOWS PROMISE FOR PROVIDING SUCH CONNECTORS IF CERTAIN PRACTICAL PROBLEMS CAN BE OVERCOME. NOVEL IMPLEMENTATION TECHNIQUES ARE PROPOSED WHICH WOULD DEMONSTRATE THE PRACTICALITY OF COMPLEX INTERCONNECTION PATTERNS.

* Information listed above is at the time of submission. *

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