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Dynamic Magnetic Consolidation (DMC) Process for Fabricating Advanced Nanostructured Components from Nano Powders

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 31785
Amount: $99,895.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1996
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2763 Culver Avenue
Dayton, OH 45429
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Bhanu Chelluri
 (513) 296-1806
Business Contact
Phone: () -
Research Institution
N/A
Abstract

This SBIR project of Phase I proposes to develop and advance a process technology called Dynamic Magnetic Compaction (DMC). This technology will be useful for fabricating nanostructured components of various material systems such as ceramics, metals, high temperature alloys, and composites from their respective nano powders. The fabrication of nano components from nano powders requires the consolidation technique that can transfer high energy in a fast manner without sacrificing nano grain size. The proposed DMC consolidation technology has the capability to achieve this. The DMC process can be scaled for the production scale. Our preliminary cost and feasibility estimates of commercial systems indicate that transition from lab to commercial systems will be reliable and economical. This project will create a new world class, high rate production process - DMC, that will have impact on key U.S. industries. In Phase I, for a feasibility demonstration, nano ceramic powders of SI3N4 and wear material powders of tungsten carbides will be consolidated into 0.5" diameter and 2" long rods. The components will be tested for their nano properties such as grain size, strength, hardness, and other relevant characteristics.

* Information listed above is at the time of submission. *

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