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Development of MgB2 for Near Term HEP Applications

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-05ER84363
Agency Tracking Number: 79464S05-I
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 35
Solicitation Number: DE-FG02-06ER06-09
Timeline
Solicitation Year: 2006
Award Year: 2005
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
110 E. Canal St.
Troy, OH 45373
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Matthew Rindfleisch
 Mr.
 (614) 481-8050
 mrindfleisch@hypertechresearch
Business Contact
 Michael Tomsic
Title: Mr.
Phone: (614) 481-8050
Email: elwalley@hotmail.com
Research Institution
N/A
Abstract

79464S Magnesium diboride (MgB2) is an emerging superconductor material, which offers the possibility of fabrication into multifilamentary strands from inexpensive starting materials using relatively conventional metalworking processes. However, in order to be useful for high energy physics (HEP) applications, several improvements will be required. This project will develop improvements for such near term applications as undulators and wigglers. For these applications, the most important needs for MgB2 wires are increases in the in-field Jc, the filling factor, the filament count, and stability. Phase I will develop technology to increase: (1) the filament count (beyond the present 37 filament) through both direct drawing routes and extrusion; (2) strand stability by the using Cu along with more conductive outer sheaths; (3) the fill factor; and (4) the Jc performance in the 3-5 T regime, at both at 4 K and at 10-20 K. Commercial Applications and Other Benefits as described by the awardee: Besides the HEP applications, an improved MgB2 should accelerate the wire being developed for other commercial applications such as MRI systems, power utility transformers, generators, motors, and military applications.

* Information listed above is at the time of submission. *

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