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Nanomaterials for High Performance Thermal Packaging

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-10ER85892
Agency Tracking Number: 94349
Amount: $99,999.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 06 c
Solicitation Number: DE-FOA-0000161
Timeline
Solicitation Year: 2010
Award Year: 2010
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): 2011-03-18
Small Business Information
3006 Longhorn Blvd. Suite 107
Austin, TX 78758
United States
DUNS: 013475129
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 James Novak
 Dr.
 (512) 339-5020
 jnovak@appliednanotech.net
Business Contact
 Zvi Yaniv
Title: Dr.
Phone: (512) 339-5020
Email: zyaniv@appliednanotech.net
Research Institution
N/A
Abstract

Modern electrical systems operate with high power consumption and as a result of the power dissipation generate much heat that can damage components and limit application lifetime. Even with the specialty materials currently used in both the electronic package as well as the mounting buss for heat dissipation, most systems still require additional cooling mechanisms. ANI proposes adaptation of a high thermal conductivity carbon aluminum composite and a Cu nanoparticle based solder to generate next generation high thermal capacity electronic packaging which will reduce or eliminate the need for external cooling loops. This new material is expected to show increased performance over traditional direct bonded copper substrates. Commercial Applications and Other Benefits: Successful development of our novel thermal management solution will provide increased options for power electronics and overall thermal management solutions.

* Information listed above is at the time of submission. *

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