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Multi-Channel Electronics for Solid-State Photodetectors
Title: Dr.
Phone: (617) 668-6800
Email: GEntine@RMDINC.com
Title: Dr.
Phone: (617) 668-6800
Email: NMarshall@RMDInc.com
Contact: Susan Hedley
Address:
Phone: (510) 486-6273
Type: Federally Funded R&D Center (FFRDC)
New solid-state photomultipliers (SSPMs) need compact integrated circuitry for readout if such photodetectors are going to be implemented in high-energy physics, nuclear physics, or nuclear medical imaging applications. The aim of this work is to significantly improve the bandwidth in reading out arrays of SSPMs by developing a custom ASIC (Application Specific Integrated Circuit). This ASIC will significantly increase the speed at which events can be recorded from the SSPM and reduce the channel count, enabling the solid-state photomultipliers to be used in high-speed applications, such as nuclear and particle physics. The goal of the proposed project is to develop multi-channel readout electronics that would allow full exploitation of the signal to noise ratio and timing capabilities of CMOS based position sensitive solid-state photomultiplier (SSPM). Integration of these components will allow us to build a very compact, low power, low cost and relatively simple detector unit for high-speed readout applications. The Phase I project will be aimed at the development of an application specified integrated circuit (ASIC) to readout our imaging SSPM technology. We will characterize the SSPM detectors, along with their 16 channel readout ASIC, and use the results to begin developing a larger, 64 channel ASIC for a larger position sensitive SSPM. Commercial Applications and Other Benefits: Beyond nuclear physics applications, these new solid-state detectors will be applicable to space-based research, homeland security, environmental monitoring and material science studies. The proposed research will investigate a promising detector technology, which will have major impact in scientific studies, health care, homeland defense, oil exploration as well as industrial applications.
* Information listed above is at the time of submission. *