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SBIR Phase I: Lead-Free Sintering Adhesives for Electronics Thermal Management

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0912842
Agency Tracking Number: 0912842
Amount: $99,998.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: EL
Solicitation Number: NSF 08-548
Timeline
Solicitation Year: N/A
Award Year: 2009
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
310 Via Vera Cruz, Suite 107
San Marcos, CA 92078
United States
DUNS: 827430583
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Matthew Wrosch
 MS
 (760) 752-1192
 mwrosch@creativeelectron.com
Business Contact
 Matthew Wrosch
Title: MS
Phone: (760) 752-1192
Email: mwrosch@creativeelectron.com
Research Institution
N/A
Abstract

This Small Business Innovation Research Phase I project will develop and characterize lead-free adhesives with very high thermal and electrical conductivity for wide bandgap semiconductor packaging. The company will build on its IP portfolio of fluxing adhesive binder systems to formulate polymer fluxes suitable for low-temperature, lead-free solders. The development of cost effective, high performance packaging systems will hasten the adoption of wide bandgap semiconductor components for high power electronic and optoelectronic applications. This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).

* Information listed above is at the time of submission. *

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