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Innovative, Low Cost, Radiation-Resistant Fusion Magnet Insulation
Title: Dr.
Phone: (303) 664-0394
Email: matt@ctd-materials.com
Title: Dr.
Phone: (303) 664-0394
Email: naseem@ctd-materials.com
75747S Newly designed and proposed fusion magnet systems will require electrical insulation capable of withstanding high temperatures and high radiation doses. The lack of cost-effective, radiation-resistant insulation systems is compromising the design and operation of these devices. Therefore, this project will develop and formulate low-cost organic resins for use in the production of fusion magnet insulation by vacuum pressure impregnation (VPI). The new materials promise to be much less expensive than current insulation materials, while providing the necessary mechanical, electrical, and thermal performance. In Phase I, new low-cost organic resin formulations were developed and the materials were used to fabricate fiber-reinforced insulation materials. The materials displayed excellent high-temperature strength and withstood thermal cycling from 76 K to 373 K with minimal change in mechanical or electrical performance. Phase II will optimize the resin formulation, scale up the synthesis process, fabricate and characterize fiber-reinforced insulation materials, and determine the radiation resistance of these new resin materials. In addition, a subscale magnet assembly will be fabricated and tested to demonstrate the use of these new insulation materials in a representative, application-specific configuration. Commercial Applications And Other Benefits as described by the awardee: New, low cost, VPI-compatible insulation systems, capable of withstanding exposure to high temperatures and having improved radiation resistance and mechanical and electrical properties, should directly affect the viability and operation of new fusion magnet designs. Lower cost insulation systems, with equal to or greater properties than current systems, should significantly reduce the material and fabrication costs of magnet systems and extend the useful lifetime of these devices.
* Information listed above is at the time of submission. *