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An Advanced Numerical Tool for Simulating and Optimizing Spray Cooling in Micro-Gravity
Title: Director/Advanced Technol
Phone: (256) 726-4800
Email: jls@cfdrc.com
Title: President & Technical Dir
Phone: (256) 726-4800
Email: aks@cfdrc.com
CFDRC proposes to develop a numerical simulation tool uniquely capable of modeling spray cooling concepts for micro-gravity applications. The tool will include effects that are critical in microgravity and cannot be thoroughly investigated using gravitydominated ground-based experiments. The research will rely heavily on the tool to better understand the physics of spray cooling under micro-gravity. This will enable more efficient design of proof-of-principal microgravity experiments. Using aninnovative extension of the Volume of Fluid method, CFDRC will simulate micro-gravity spray cooling on the microscopic level, and incorporate the results into a system level model. The tool will be developed based on CFDRC's existing simulation tools forflow, spray, heat transfer, and free surface phenomena, thereby ensuring a high probability of success.The project will be conducted in close collaboration with Swales Aerospace, a leader in the development and testing of innovative cooling equipment for space applications. The capability to predict the effective heat transfer for selected spray coolingexperiments will be demonstrated in Phase I. One-gravity results will used to validate the tool and then numerically extrapolate to micro-gravity. Phase II will include detailed design, fabrication and proof-of-principal hardware based on the findings ofPhase I. An improved understanding of spray cooling in microgravity will benefit the development of spray cooling technology for both space-based and ground-based applications. Furthermore, the improved ability to model free surface flows in microgravity willbenefit other space-based applications involving fluid management in micro-gravity. A model of phase change in superheated layers will have direct relevance in other important industries such as MEMS and inkjet printing.
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