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Multiband Infrared Focal Plane Array for Seeker Applications

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-07-C-7710
Agency Tracking Number: B063-016-0637
Amount: $99,940.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MDA06-016
Solicitation Number: 2006.3
Timeline
Solicitation Year: 2006
Award Year: 2007
Award Start Date (Proposal Award Date): 2007-04-02
Award End Date (Contract End Date): 2007-10-02
Small Business Information
1879 Austin Bluffs Parkway
Colorado Springs, CO 80918
United States
DUNS: 621633296
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Steve Gaalema
 President
 (719) 593-9501
 sgaalema@bfe.com
Business Contact
 Tyler Erickson
Title: Design Engineer
Phone: (719) 593-9501
Email: terickson@bfe.com
Research Institution
N/A
Abstract

Improved interceptor seeker capability to detect, identify, and discriminate re-entry vehicles (RV’s) from countermeasures at distances of hundreds of kilometers is critical for missile defense. Development of an advanced infrared seeker combining high-spatial resolution with multiband detection for spectral discrimination is desired for material identification and RV discrimination. The challenge is to develop multiband sensors of greater sensitivity, higher resolution, and larger field-of-view to increase detection and tracking range. The sensor needs to be affordable, reliable, and operate at elevated temperature. Corrugated architecture quantum well infrared photodetectors (C-QWIPs) meet many seeker detector requirements and have recently demonstrated improved quantum efficiency and multiband capability. Black Forest Engineering's (BFE) readout integrated circuits provide large charge capacity and dark current subtraction that allows increase of C-QWIP operating temperature. BFE will design a 25x25 μm2 area pixel that will allow readout of 4-band collocated QWIPs in a near simultaneous mode. The Phase I design will include system modeling and fabrication plan for a large format sensor development on Phase II.

* Information listed above is at the time of submission. *

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