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Advanced Multi-Temperature Load Cooler

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: F2960103C0200
Agency Tracking Number: 02-1219
Amount: $0.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2003
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
3319 21st Ave NW
Gig Harbor, WA 98335
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Douglas Beck
 Engineer
 (253) 853-1703
 dbeck23@aol.com
Business Contact
 Douglas Beck
Title: President
Phone: (253) 853-1703
Email: dbeck23@aol.com
Research Institution
N/A
Abstract

The Missile Defense Agency (MDA) requires the capability to provide cryogenic cooling for infrared sensing, cryogen management, electronics cooling, and superconductivity for long term (over five year) space missions. Multistage cryocoolers have thepotential to reduce the number of coolers needed on a spacecraft and, and therefore, reduce overall system mass and power consumption, and improve reliability. In Phase II, we propose to continue developing a Multi-Temperature Load Cooler (MTLC) that haspotential to be much more compact, lightweight, and efficient than other types of multistage coolers, especially for applications that require cooling at low temperatures (less than about 35K). Our cooler will provide stable cooling for variouselectronics or focal plane arrays. In Phase I, we are demonstrating the operation of a breadboard MTLC. In Phase II, we will build, test, and deliver to the AFRL an engineering development model (EDM) cooler that simultaneously lifts heat at 35K and 60K.We will develop the mechanical cooler, but we will continue to use breadboard electronics. In option tasks and Phase III, we will design, build, sell, and license our cooler technology to MDA contractors to include in MDA programs.

* Information listed above is at the time of submission. *

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